HEATPIPE ASSEMBLIES THERMAL MANAGEMENT MAKING YOUR HEATPIPE ASSEMBLY MOST EFFICIENT AND THERMALLY BEST
APPLICATION
HEATPIPE ASSEMBLIES Thermal Management
Phase Change Films Printable Dispensable TPC-Z-PC TPC-Z-PC-P TPC-Z-PC-D TPC-T-AL-CB TPC-X-PC-NC TPC-S-AL Graphite foil TFO-S-CB Silicone foil TEL-Z-SI Please contact us as your development partner.
ΔT DATA 10
Phase Change Graphite Foil
Silicone foil
4
2
Phase Change Film
Phase Change Film
6
Phase Change
∆T (°C)@ 25W / cm2
8
B
C
SC
TF O-
N
CXP
C-
SI
L
Z-
TE
SA
TP
C-
-C AL
TC-
L-
TP
TP
TP
CZ
-P
C(
-D
/P
)
B
0
Creating Maximum thermal contact Minimized thermal resistance Compensating mechanic tolerances Enhancing efficiency Benefits Increasing long-term reliability Homogenizing temperatures Pre-applied dry-to-the-touch Chip 220µm Solder 80µm
Bond Wire Copper 150µm AIO Substrate 380µm Copper 150µm Solder 80µm Base Plate 3 mm Thermal Interface Material 50µm Heat Sink
Typical module configuration with baseplate (Copper)
Chip 220µm Solder 80µm
All technical data and information are without warranty and believed to be reliable and accurate. Since are unknown we cannot guarantee results, freedom from patent infringement, or their suitability for any
HALA Thermal Interface Solutions
the products are not provided to conform with mutually agreed specifications and their use and processing / Release 9 / 2014 application. Product testing by the applicant is recommended. We reserve the right of changes.
making your heatpipe assembly most efficient and thermally best
Bond Wire Copper 150µm AIO Substrate 380µm Copper 150µm Thermal Interface Material 50µm Heat Sink
HALA Contec GmbH & Co. KG / Blumenstraße 12 / D-73777 Deizisau / Fon +49 7153 99350-0 / Fax +49 7153 99350-99 /
[email protected] / www.hala-tec.de Typical module configuration without baseplate
