POWER MODULES THERMAL MANAGEMENT MAKING YOUR POWER MODULE REALIABLE AND THERMALLY BEST
APPLICATION
POWER MODULES Thermal Management making your power module realiable and thermally best
HALA Thermal Interface Solutions
2
Silicone foil
Phase Change Film
Phase Change
4
Graphite Foil
0
0
TP C
TP C
-Z -P C(
Silicone foil TEL-Z-SI
6
-D /P ) -T -A LCB TP CSAL TE LZTP SI CXPC -N C TF OSCB
Graphite foil TFO-S-CB 0
∆T (°C)@ 25W / cm2
60 Phase Change Films Printable Dispensable 10 TPC-Z-PC TPC-Z-PC-P TPC-Z-PC-D TPC-T-AL-CB TPC-X-PC-NC 30 TPC-S-AL 5
Phase Change Film
8
15
Please contact us as your development partner. ∆ T TIM ∆ T System
Module EconoPACK™ +
T
∆ T TIM
Position
ΔT DATA
CONSTRUCTION DIAGRAM
10
Silicone foil
C TF O-
CXP
SC
2
N
SI
L
Z-
haftend
3
haftend
Bond Wire
Chip 220µm Solder 80µm
Copper 150µm AIO Substrate 380µm Copper 150µm Thermal Interface Material 50µm Heat Sink
4 haftend
TP
TE
haftend
TP
L-
1
SA
-C
AL
-D
T-
TP
C-
C( -P CZ
C-
/P
)
B
haftend Elastomer
Graphite Foil
Oberfächen- Glasfaserbehandelt laminat nicht haftend nicht haftend nicht haftend B
Filmlaminat
0
TP
Heat Sink Typical module configuration with baseplate (Copper)
C-
2
Phase Change Film
Phase Change Film
4 Phase Change
∆T (°C)@ 25W / cm2
N
6
Copper 150µm AIO Substrate 380µm Copper 150µm Solder 80µm Base Plate 3 mm Thermal Interface Material 50µm
Phase Change
P
8
Bond Wire
Chip 220µm Solder 80µm
Typical module configuration without baseplate
CrEating Maximum thermal contact Minimized thermal resistance Compensating mechanic tolerances Enhancing efficiency Benefits Increasing long-term reliability Minimizing chip temperatures Homogenizing chip temperatures Bond Wire Chip 220µm Pre-applied dry-to-the-touch Solder 80µm
Module Copper 150µm AIO Substrate 380µm Copper 150µm Solder 80µm Base Plate 3 mm Thermal Interface Material 50µm Heat Sink
All technical data and information are without warranty and believed to be reliable and accurate. Since the products are not provided to conform with mutually agreed specifications and their use and processing / Release 9 / 2014 are unknown we cannot guarantee results, freedom from patent infringement, or their suitability for any application. Product testing by the applicant is recommended. We reserve the right of changes.
10
Phase Change
90
20
Typical module configuration with baseplate (Copper)
Chip 220µm Solder 80µm
Bond Wire Copper 150µm AIO Substrate 380µm Copper 150µm Thermal Interface Material 50µm Heat Sink
HALA Contec GmbH & Co. KG / Blumenstraße 12 / D-73777 Deizisau / Fon +49 7153 99350-0 / Fax +49 7153 99350-99 /
[email protected] / www.hala-tec.de Typical module configuration without baseplate