heatpipe assemblies thermal management


All technic al data and information are without w arranty and belie ved to be reliable and ac curate. Sinc e the products are not pro vided to c onfor...

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HEATPIPE ASSEMBLIES THERMAL MANAGEMENT MAKING YOUR HEATPIPE ASSEMBLY MOST EFFICIENT AND THERMALLY BEST

APPLICATION

HEATPIPE ASSEMBLIES Thermal Management

Phase Change Films Printable Dispensable TPC-Z-PC TPC-Z-PC-P TPC-Z-PC-D TPC-T-AL-CB TPC-X-PC-NC TPC-S-AL Graphite foil TFO-S-CB Silicone foil TEL-Z-SI Please contact us as your development partner.

ΔT DATA 10

Phase Change Graphite Foil

Silicone foil

4

2

Phase Change Film

Phase Change Film

6

Phase Change

∆T (°C)@ 25W / cm2

8

B

C

SC

TF O-

N

CXP

C-

SI

L

Z-

TE

SA

TP

C-

-C AL

TC-

L-

TP

TP

TP

CZ

-P

C(

-D

/P

)

B

0

Creating Maximum thermal contact Minimized thermal resistance Compensating mechanic tolerances Enhancing efficiency Benefits Increasing long-term reliability Homogenizing temperatures Pre-applied dry-to-the-touch Chip 220µm Solder 80µm

Bond Wire Copper 150µm AIO Substrate 380µm Copper 150µm Solder 80µm Base Plate 3 mm Thermal Interface Material 50µm Heat Sink

Typical module configuration with baseplate (Copper)

Chip 220µm Solder 80µm

All technical data and information are without warranty and believed to be reliable and accurate. Since are unknown we cannot guarantee results, freedom from patent infringement, or their suitability for any

HALA Thermal Interface Solutions

the products are not provided to conform with mutually agreed specifications and their use and processing / Release 9 / 2014 application. Product testing by the applicant is recommended. We reserve the right of changes.

making your heatpipe assembly most efficient and thermally best

Bond Wire Copper 150µm AIO Substrate 380µm Copper 150µm Thermal Interface Material 50µm Heat Sink

HALA Contec GmbH & Co. KG / Blumenstraße 12 / D-73777 Deizisau / Fon +49 7153 99350-0 / Fax +49 7153 99350-99 /[email protected] / www.hala-tec.de Typical module configuration without baseplate