TECHNOLOGY SOLUTIONS
Optical Sensors As technology advances in society, we will increasingly rely on developments in optical sensors to enhance reliable and fast sensing applications for the future. Optical sensors convert various wavelengths into electrical signals for enhanced sensing applications. Ambient, infrared (IR) and ultraviolet (UV) light are some wave types that optical sensors measure to create applications for autonomous cars, in-display fingerprint scanners, secure facial recognition and many others. The combination of multiple sensors and light sources are crucial to creating a reliable and cohesive sensing system. The adoption of many optical sensors is growing as we rely more on technology to sense the outside world for us.
OPTICAL SENSOR PACKAGING CONSIDERATIONS Amkor Technology is the world leader in Optical Sensor packaging technology and the world’s largest outsource provider of sensor packages.
GENERAL REQUIREMENTS ff Cleanliness control
Optical Sensor Applications Amkor Technology is the world’s leading expert in packaging technologies which allows our standardized packages to support flexible applications. MEMS/Sensor
Consumer Devices
Automotive
Fingerprint
LIDAR
Health & Fitness
Home/ Industrial
CIS
Ambient
3D Depth Sensing
CONSUMER MARKET
ToF/AR/VR
ff Package integration
IR
UV
Spectrometer
ff Sensor tilt/shift management ff Optical specific materials
ff Cost effective solutions
ff Miniaturization roadmap
Gas
AUTOMOTIVE MARKET ff More stringent device package protection
ff IATF 16949 certification ff AEC-Q100 reliability
Thermopile
Amkor’s Value Proposition ff Optical sensor manufacturing ▷▷ Standard platforms = faster development ▷▷ Faster introduction of new products ff Lower development cost ff Amkor experience ▷▷ Dedicated optical sensor team ▷▷ Constantly updating the Optical Sensor Toolbox with investments in new equipment and materials and leveraging R&D developments ▷▷ In-house test development capability
Optical Sensor Package and Board Level Reliability
Optical Assembly Toolbox
Amkor offers a full range of reliability test capabilities in multiple locations.
ff ff ff ff ff ff ff ff ff ff
Modeling and Simulation Complete electrical, thermo-mechanical capabilities via Solder joint reliability, wire joint reliability, temperature distribution in package, air flow in enclosure, S-parameter, waveform. Amkor presently conducts sensor-related activities at the following strategic manufacturing locations ff China (ATC) ff Korea (ATK)
ff Japan (J-Devices) ff Philippines (ATP)
Particle Control Precise Focal Tolerances Exposed and Cavity Expertise Transparent Adhesives CoB/CoW/CoC Fine Pitch Interconnect Multi-die Integration w/Passives Filter/Lens Holder Ready Optical Test Development Automotive Grade Materials and Assembly
Optical Sensor Packages Open Tool Available (Sample Builds)
Lead Count
Body Width (mm)
Body Length (mm)
Body Thickness (mm)
Pkg Type
Glass/Lid Type
Die Qty
Interconnect
Factory
80
11
12
2
Cavity BGA
Glass
Multi-die
WB
P3/K4
8
9
10
0.6
Film Assist Mold
Glass
Multi-die
WB
C3/K4/JFO
8
5
2
1
Molded Cavity LGA
Polymer
Multi-die
WB
K4
22
6.8
4.9
1.35
Cavity LGA
Polymer with Glass/Filter
Multi-die
WB
K4
Specs will vary depending on customer requirements
Optical Sensor Package Standards Package Type
Exposed Die Molded
Cavity Package
ChipArray® LGA/FPBGA
Available substrate in laminate and ceramic
Visit amkor.com or email
[email protected] for more information. With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2018 Amkor Technology Incorporated. All Rights Reserved. TS113A Rev Date: 11/18
