power modules thermal management


annot guarantee results, freedom from patent infringement, or their suitability for any applic ation. Product tes ting by the applic ant is rec ommend...

1 downloads 0 Views 728KB Size

POWER MODULES THERMAL MANAGEMENT MAKING YOUR POWER MODULE REALIABLE AND THERMALLY BEST

APPLICATION

POWER MODULES Thermal Management making your power module realiable and thermally best

HALA Thermal Interface Solutions

2

Silicone foil

Phase Change Film

Phase Change

4

Graphite Foil

0

0

TP C

TP C

-Z -P C(

Silicone foil TEL-Z-SI

6

-D /P ) -T -A LCB TP CSAL TE LZTP SI CXPC -N C TF OSCB

Graphite foil TFO-S-CB 0

∆T (°C)@ 25W / cm2

60 Phase Change Films Printable Dispensable 10 TPC-Z-PC TPC-Z-PC-P TPC-Z-PC-D TPC-T-AL-CB TPC-X-PC-NC 30 TPC-S-AL 5

Phase Change Film

8

15

Please contact us as your development partner. ∆ T TIM ∆ T System

Module EconoPACK™ +

T

∆ T TIM

Position

ΔT DATA

CONSTRUCTION DIAGRAM

10

Silicone foil

C TF O-

CXP

SC

2

N

SI

L

Z-

haftend

3

haftend

Bond Wire

Chip 220µm Solder 80µm

Copper 150µm AIO Substrate 380µm Copper 150µm Thermal Interface Material 50µm Heat Sink

4 haftend

TP

TE

haftend

TP

L-

1

SA

-C

AL

-D

T-

TP

C-

C( -P CZ

C-

/P

)

B

haftend Elastomer

Graphite Foil

Oberfächen- Glasfaserbehandelt laminat nicht haftend nicht haftend nicht haftend B

Filmlaminat

0

TP

Heat Sink Typical module configuration with baseplate (Copper)

C-

2

Phase Change Film

Phase Change Film

4 Phase Change

∆T (°C)@ 25W / cm2

N

6

Copper 150µm AIO Substrate 380µm Copper 150µm Solder 80µm Base Plate 3 mm Thermal Interface Material 50µm

Phase Change

P

8

Bond Wire

Chip 220µm Solder 80µm

Typical module configuration without baseplate

CrEating Maximum thermal contact Minimized thermal resistance Compensating mechanic tolerances Enhancing efficiency Benefits Increasing long-term reliability Minimizing chip temperatures Homogenizing chip temperatures Bond Wire Chip 220µm Pre-applied dry-to-the-touch Solder 80µm

Module Copper 150µm AIO Substrate 380µm Copper 150µm Solder 80µm Base Plate 3 mm Thermal Interface Material 50µm Heat Sink

All technical data and information are without warranty and believed to be reliable and accurate. Since the products are not provided to conform with mutually agreed specifications and their use and processing / Release 9 / 2014 are unknown we cannot guarantee results, freedom from patent infringement, or their suitability for any application. Product testing by the applicant is recommended. We reserve the right of changes.

10

Phase Change

90

20

Typical module configuration with baseplate (Copper)

Chip 220µm Solder 80µm

Bond Wire Copper 150µm AIO Substrate 380µm Copper 150µm Thermal Interface Material 50µm Heat Sink

HALA Contec GmbH & Co. KG / Blumenstraße 12 / D-73777 Deizisau / Fon +49 7153 99350-0 / Fax +49 7153 99350-99 /[email protected] / www.hala-tec.de Typical module configuration without baseplate