thermo-electric modules thermal management


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THERMO-ELECTRIC MODULES THERMAL MANAGEMENT MAKING YOUR THERMO-ELECTRIC MODULE MOST EFFICIENT AND THERMALLY BEST

APPLICATION

THERMO-ELECTRIC MODULES Thermal Management

8 60

10

Graphite Foil

30

6

4

2

0

0

0 /P -D C(

Creating Maximum thermal contact Minimized thermal resistance Compensating mechanic tolerances Enhancing efficiency

∆ T System

T

∆ T TIM

Position

Benefits Increasing long-term reliability Homogenizing temperatures Pre-applied dry-to-the-touch Chip 220µm Solder 80µm

Chip 220µm Solder 80µm

P

Bond Wire Copper 150µm AIO Substrate 380µm Copper 150µm Solder 80µm Base Plate 3 mm Thermal Interface Material 50µm

N

Typical module config

Heat Sink Typical module configuration with baseplate (Copper) Filmlaminat

Chip 220µm Solder 80µm

Bond Wire

haftend Copper 150µm AIO Substrate 380µm 1 Elastomer Copper 150µm haftend Thermal Interface Material 50µm

TP C-

ZP TP C-

∆ T TIM

TA

B

C

SC

TF O-

N

CXP

C-

SI

L

Z-

TE

SA

TP

C-

-C AL

TC-

L-

TP

TP

TP

CZ

-P

C(

-D

/P

)

B

)

0

5

∆T (°C)@ 25W / cm2

15

Oberfächen- Glasfaserbehandelt laminat nicht haftend nicht haftend nicht haftend 2

haftend

3 haftend

Chip 220µm Solder 80µm

4 haftend

Typical module config

Heat Sink

HALA Contec GmbH & Co. KG / Blumenstraße 12 / D-73777 Deizisau / Fon +49 7153 99350-0 / Fax +49 7153 99350-99 /[email protected] / www.hala-tec.de Typical module configuration without baseplate

Phase Change Film

10

Phase Change

Phase Change

Silicone foil

4

2

Phase Change Film

Phase Change Film

6

Phase Change

∆T (°C)@ 25W / cm2

8

90

-

20

AL

ΔT DATA 10

-Z

Please contact us as your development partner.

S-

Silicone foil TEL-Z-SI

TE L

Graphite foil TFO-S-CB

C-

Phase Change Films Printable Dispensable TPC-Z-PC TPC-Z-PC-P TPC-Z-PC-D TPC-T-AL-CB TPC-X-PC-NC TPC-S-AL

L-

HALA Thermal Interface Solutions

All technical data and information are without warranty and believed to be reliable and CB accurate. Since the products are not provided to conform with mutually agreed specifications and their use and processing / Release 9 / 2014 TP their are unknown we cannot guarantee results, freedom from patent infringement, or suitability for any application. Product testing by the applicant is recommended. We reserve the right of changes. Phase Change Film

making your Thermo-Electric Module most efficient and thermally best