THERMO-ELECTRIC MODULES THERMAL MANAGEMENT MAKING YOUR THERMO-ELECTRIC MODULE MOST EFFICIENT AND THERMALLY BEST
APPLICATION
THERMO-ELECTRIC MODULES Thermal Management
8 60
10
Graphite Foil
30
6
4
2
0
0
0 /P -D C(
Creating Maximum thermal contact Minimized thermal resistance Compensating mechanic tolerances Enhancing efficiency
∆ T System
T
∆ T TIM
Position
Benefits Increasing long-term reliability Homogenizing temperatures Pre-applied dry-to-the-touch Chip 220µm Solder 80µm
Chip 220µm Solder 80µm
P
Bond Wire Copper 150µm AIO Substrate 380µm Copper 150µm Solder 80µm Base Plate 3 mm Thermal Interface Material 50µm
N
Typical module config
Heat Sink Typical module configuration with baseplate (Copper) Filmlaminat
Chip 220µm Solder 80µm
Bond Wire
haftend Copper 150µm AIO Substrate 380µm 1 Elastomer Copper 150µm haftend Thermal Interface Material 50µm
TP C-
ZP TP C-
∆ T TIM
TA
B
C
SC
TF O-
N
CXP
C-
SI
L
Z-
TE
SA
TP
C-
-C AL
TC-
L-
TP
TP
TP
CZ
-P
C(
-D
/P
)
B
)
0
5
∆T (°C)@ 25W / cm2
15
Oberfächen- Glasfaserbehandelt laminat nicht haftend nicht haftend nicht haftend 2
haftend
3 haftend
Chip 220µm Solder 80µm
4 haftend
Typical module config
Heat Sink
HALA Contec GmbH & Co. KG / Blumenstraße 12 / D-73777 Deizisau / Fon +49 7153 99350-0 / Fax +49 7153 99350-99 /
[email protected] / www.hala-tec.de Typical module configuration without baseplate
Phase Change Film
10
Phase Change
Phase Change
Silicone foil
4
2
Phase Change Film
Phase Change Film
6
Phase Change
∆T (°C)@ 25W / cm2
8
90
-
20
AL
ΔT DATA 10
-Z
Please contact us as your development partner.
S-
Silicone foil TEL-Z-SI
TE L
Graphite foil TFO-S-CB
C-
Phase Change Films Printable Dispensable TPC-Z-PC TPC-Z-PC-P TPC-Z-PC-D TPC-T-AL-CB TPC-X-PC-NC TPC-S-AL
L-
HALA Thermal Interface Solutions
All technical data and information are without warranty and believed to be reliable and CB accurate. Since the products are not provided to conform with mutually agreed specifications and their use and processing / Release 9 / 2014 TP their are unknown we cannot guarantee results, freedom from patent infringement, or suitability for any application. Product testing by the applicant is recommended. We reserve the right of changes. Phase Change Film
making your Thermo-Electric Module most efficient and thermally best